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2026-11-03
HiFlow to Showcase AI-Powered ERP at Digital Packaging Summit 2026

Gold Sponsor HiFlow Solutions will feature folding carton manufacturer Wausau Container Corp. in an executive boardroom case study focused on connected operations, real-time visibility and the next generation of AI-powered ERP. 

MIAMI, FL — November 9, 2026 — HiFlow Solutions, provider of AI-Powered ERP That Does Real Work for packaging and print manufacturers, will be a Gold Sponsor of the Digital Packaging Summit, November 16–18, 2026, at the Hyatt Regency Coconut Point Resort and Spa in Bonita Springs, Florida.

The invitation-only event brings together senior executives from the label, flexible packaging, folding carton and corrugated markets to explore technologies and strategies shaping the future of digital packaging production.

As part of its participation, HiFlow will present a boardroom case study featuring Amy Plier, owner of Wausau Container Corp., a Wisconsin-based folding carton manufacturer that selected HiFlow to replace a legacy business system and create a more connected view of its operation.

Wausau’s previous environment included disconnected systems and manual processes that made it increasingly difficult to manage information across the business. The company wanted an ERP designed for folding carton manufacturing that could integrate operations, improve real-time visibility and scale as the business grew.

“We did not want siloes of information — we wanted to see a full 360-degree real-time view of our business,” Plier said of the company’s objectives. HiFlow’s connected ERP, MES capabilities, smart scheduling, purchasing and reporting have helped Wausau move toward that goal.

From System of Record to System of Action

The boardroom discussion will examine Wausau’s ERP evaluation process, the operational issues that drove the decision to change systems, the implementation experience and how greater integration is helping the company manage production more effectively.

It will also provide a practical backdrop for discussing where ERP technology for packaging manufacturing is heading next.

“Digital Packaging Summit is an ideal environment for this conversation because attendees are looking for practical examples of technology solving real manufacturing problems,” said Mariusz Sosnowski, President of HiFlow Solutions. “Wausau’s experience demonstrates the importance of connecting the business first. From there, AI creates an opportunity for the ERP to take on more of the repetitive work that still consumes employees’ time.”

HiFlow is currently putting AI to work across six AI-powered workflows spanning estimate processing, order processing, supplier deliveries, supplier pricing, bills of lading and accounts payable. The company’s AI Quote Agent introduces a conversational approach to estimating and represents another step toward HiFlow’s emerging Agentic ERP direction.

Built for How Converters Are Evolving

The message HiFlow will bring to the Summit is straightforward: Everyone Is Talking About AI. HiFlow Is Putting It to Work.

Attendees will also have opportunities to meet directly with the HiFlow team during the Summit to discuss ERP modernization, workflow automation, AI and the operational challenges facing packaging manufacturers.

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